Technical Program
Committee
- Bobin Deng, Kennesaw State University, USA
- Charan Gudla, Mississippi State University, Starkville, United States
- Weizheng Gao, Elizabeth City State University, USA
- Wanwan Li, University of Tulsa(TU), USA
- Chin-Shiuh Shieh, National Kaohsiung University of Science and Technology, Taiwan
- Dandan Li, Beijing University of Posts and Telecommunications
- Suja A. Alex, St. Xavier's Catholic College of Engineering Chunkankadai, India
- Mohammed Elmorsy, MacEwan University, Canada
- Rishabh Sharma, Hewlett Packard Enterprise, Milpitas, California
- Carine Pierrette Mukamakuza, Carnegie Mellon University Africa, Rwanda
- Sen Xu, Shenyang University of Chemical Technology, China
- Tian Song, Tokushima University, Japan
- Robert Marshall, Capella University, USA
- Erica Teixeira Gomes de Sousa, Federal Rural University of Pernambuco, Brazil
- Ajay Jain, Adobe Document Cloud, USA
- Bo Qiu, Hebei University of Technology,China
- Christopher Mansour, Mercyhurst University, USA
- Tomonobu Ozaki, Nihon University, Japan
- Gabriel Gomes de Oliveira, University of Campinas, Brazil
- Kun Xie, Beijing University of Posts and Telecommunications
- Wai Mok, The University of Alabama in Huntsville, United States
- Ahmed Sayed, Milwaukee School of Engineering, USA
- Nooh Bany Muhammad, Frostburg State University, USA
- Atanas Hristov, University of Information Science and Technology“St. Paul the Apostle”, USA
- Nelly Elsayed, University of Cincinnati, USA
- Paria Assari, Islamic Azad University of Hamadan, Iran
- Md Shohel Rana, Florida Gulf Coast University, United States
- Subhash Bagui, University of West Florida, USA
- Ping Wang, Robert Morris University, United States
- Shekhar R, Alliance University, India
- Driss Kettani, Al-Akhawayn University, Morocco
- Robinson Jiménez-Moreno, Militar Nueva Granada University, Colombia
- Funminiyi Olajide, University of Westminster, UK
- Chengwei Lei, California State University, United States